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| Hunan Oukefa Technology and Shenzhen Chengxin Kang adhesive reached a strategic cooperation to expand the electronic adhesive market
On June 6, 2024, Hunan Oukefa Technology Co., Ltd. and Shenzhen Chengxin Kang Adhesive Co., Ltd. officially reached a strategic cooperation, and the two sides will work together in the sales business of electronic adhesives to inject new vitality into the development of the industry.
The strategic collaboration focuses on a wide range of high-performance electronic adhesive products covering a wide range of application scenarios. Among them, in the field of additive potting adhesives, we have launched products with different thermal conductivity properties such as 0.7W, 1.5W and 2.0W.
0.7W potting adhesive includes 608gl and 608LD, key indicators such as viscosity, specific gravity, thermal conductivity, hardness, surface dry, etc. have reached the advanced level of the industry, suitable for photovoltaic inverters, LED power supplies, battery potting and other fields.
The 608-1.5gl and 608-1.5H models with 1.5W potting adhesive are ideal for applications such as photovoltaic inverters and automotive electrical controls due to their excellent performance parameters such as viscosity, specific gravity, thermal conductivity, etc.
The 608-2.0(H) and 608-2.0(350) models of 2.0W plus molded potting adhesive are excellent in terms of viscosity, specific gravity and thermal conductivity, mainly used in the field of energy storage inverters and automotive electronic control.
In addition, in terms of single-component thermal gel, 3.5W and 5W products are provided, and the key indicators include thermal conductivity, thermal resistance, BLT and extrusion rate, which is suitable for computers, servers, mobile phones, IGBTs and other equipment. The 2W products of the two-component thermal gel perform well in key indicators such as thermal conductivity, extrusion speed and specific gravity, and are widely used in the field of fast charge and power batteries.
In terms of RTV room temperature vulcanization bonding sealant, models 8408FX-10, 8450MZW, 906T and 8401M have excellent hardness, surface dry, specific gravity, extrusion rate, viscosity and bonding strength, which can meet a variety of needs such as electronic component fixation and thermal bonding.
In terms of single-component epoxy, products such as 6801, 951 and 956 have different viscosity and curing characteristics, and are compared to well-known products in the industry such as g500 and 6065.
Silicone grease products, such as 410, 450 and 520G, perform well in terms of viscosity, specific gravity and thermal conductivity, suitable for IGBTs, charging modules and other scenarios.
Through this strategic cooperation, Hunan Oukefa Technology Co., Ltd. and Shenzhen Chengxin Kang Adhesive Co., Ltd. will give full play to their respective advantages, integrate resources, jointly promote the innovation and development of electronic adhesives industry, and provide customers with better quality and more comprehensive products and services. It is believed that with the joint efforts of both sides, we will achieve more brilliant achievements in the electronic adhesive market. |
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